“We’re fortunate to be at the confluence of a global trend,” stated Mr. Asselstine. “Everything today has the potential to be transformed into a smart object. These are truly exciting times as we begin to uniquely enable the Internet of Things.”
About Terepac Corporation
Founded in 2004,Terepac Corporation, “the tiny electronics company™”, has developed a breakthrough semiconductor packaging and assembly method to allow effective handling and packaging of the tiniest imaginable chips, objects and electronic components – at its limit to the nanometer scale.
As a result, sophisticated microelectronics can be printed on flexible substrates at a fraction of the size and cost of conventional methods. Entire structures with microprocessors, memory and sensors can be reduced to less than a millimeter square, thinner than paper, and flexible enough to bend around a pencil - with no sacrifice in performance.
Terepac makes it possible to significantly reduce the size and weight of electronics in existing devices, and to embed electronics onto or into devices where previously not thought possible. Terepac Corporation is privately held with headquarters in Waterloo, Ontario, Canada. For more information, please visit www.terepac.com.