SMT Magazine is Now an I-Connect007 Publication
Tweet This ArticleTweet    Send Us Feedback About This ArticleFeedback    E-Mail This Article To A FriendE-Mail    Print This ArticlePrint
Book Review: A "Have To" for Electronic Packaging
Thursday, December 01, 2011 | Dan Beaulieu, D.B. Management Group

A book recommendation from Dan Beaulieu
 
Semiconductor Packaging: Materials Interaction and Reliability
By: Andrea Chen and Randy Hsiao-Yu Lo
Copyright 2012 by the CRC Press/Taylor & Francis Group
Price: $149. 95 (available at www.crcpress.com)
Pages: 198 with index 

Anyone involved with any aspect of electronic packaging should have this book. Meticulously written and organized by authors Chen and Hsiao-Yu Lo this book has everything needed to develop a complete understanding of semiconductor packaging, particularly how materials interact with one another.

As a pure layman when it comes to this subject, I can testify that this book is easy to read and, more importantly, easy to understand, which is a real tribute to the authors.

An Wang once said that true genius is taking something complicated and making it simple to understand. This handbook is a living example of that sentiment.

Each chapter covers a different element of semiconductor packaging from surface mount technology to materials used in semiconductor packaging and how they react to each other to ceramics and glasses to light-emitting diodes.

Particularly valuable are the appendices from the chapter describing analytical tools, what they are and how they are used and the chapter on destructive tools and tests.

One of the things that struck me was how the authors could take a fairly dry subject and bring it to life. In chapter nine, for example, Trends and Challenges, there is a discussion of future interconnect materials and what is going to have to be done when the materials we know reach their maximum efficiency next year.

The authors state that we will have to move away from the materials that are known to us today and discuss possible solutions that might develop in the very near future, including adapting different design and packaging options; different geometry, such as developing three dimensional (3D) structures, or going into what they call radical solutions, such as nanowires or nanotubes, molecules and spin and quantum wave structures. Pretty far out for solutions right around the corner.

Finally, whether an experienced engineer involved in electronic packaging or a novice, you need to make sure that this volume is a part of your technical library.


To sign up for our newsletters, click here.

Tweet This ArticleTweet    Send Us Feedback About This ArticleFeedback    E-Mail This Article To A FriendE-Mail    Print This ArticlePrint


Related Articles:
  • Book Review: Brand Real
  • Book Review: Nanovation
  • Book Review: Whoever Makes the Most Mistakes Wins
  • Book Review: e2 Continuous Improvement System
  • Book Review: Selling to the New Elite
  • Book Review: Full Engagement!

  • MOST READ
    MOST EMAILED