Nordson ASYMTEK, a leader in dispensing, coating, and jetting technologies, announces that Steven J. Adamson, Nordson ASYMTEK marketing specialist, was honored with the Daniel C. Hughes, Jr. Memorial Award, which is presented to those who have made the greatest contribution to IMAPS and the microelectronics packaging industry, including technical and service contributions. IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging. The award was presented during the IMAPS conference in Long Beach, California, October 11, 2011.
Adamson has been an active member of IMAPS for many years. He was Chairman of the San Diego chapter for two years, General Chairman of the 2006 International Symposium on Microelectronics, and served as President in 2008. In 2009 Adamson volunteered to be Chairman of the IMAPS Microelectronic Foundation. This organization is devoted to helping students and academia participate in IMAPS activities through grants and awards. In 2010, Adamson received the IMAPS President's Award in recognition of his lifelong efforts for the organization.
"This is the most prestigious award given by IMAPS," said Howard Imhof, Advanced Coatings Division Manager for Metalor Technologies USA and IMAPS 1st Past President 2011. "We appreciate Steve's continued contributions to IMAPS and the Foundation. This recognition is well deserved!"
"I am truly honored to receive this award," said Adamson. "When I was president of IMAPS in 2008 I realized how important it was to include students in our activities and how much even a small grant could make a difference in the life of a student member. Since then we instituted a foundation and have held fundraising activities so we can fund paper writing contests and provide funds for students to travel to workshops and conferences which will lead to exposure to the industry and prospective employers. It is my hope that people continue to support the foundation, provide a small grant for research, or attend one of our fun events."
Adamson has over 30 years experience in microelectronics assembly. An employee of Nordson ASYMTEK since 1998, he's held positions as applications engineering manager and marketing specialist. He has worked in all aspects of packaging and assembly from R&D to manufacturing, designing multi-chip modules, hybrid circuits, PCBs, thermal printed heads and magneto-resistive head assemblies. He has delivered technical papers on wire bond encapsulation, chip scale package and flip chip assembly, PCB design rules and reliability and has had papers published in leading industry trade journals both domestically and internationally. He is co-author with Charles Harper on a book, titled Handbook of Plastic Processes, published by McGraw-Hill.
Adamson previously held positions with Kodak, Motorola in the U.S., and Plessey, International Computers Ltd in the U.K. He has been awarded five U.S. and two UK patents. In 2005 he was presented with an award by the San Diego Engineering Council for Outstanding Service to Electrical Engineering. Originally from the U.K., he holds a Higher National Certificate in Electrical Engineering from Stockport College of Technology and for several years was the lead instructor and advisor to the University of California San Diego (UCSD) extension course on Microelectronic and Optical Packaging.