In this issue, we shine a spotlight on the challenges and solutions related to printing increasingly miniaturized, complex applications.
Our feature article this month comes from a team of experts at Alcatel-Lucent: "Creep Corrosion of OSP and ImAg PWB Finishes."
Today, largely due to assembly miniaturization, increased component density and higher-temperature, lead-free alloys, cleaning has once again rejoined the assembly process.
This issue is jam-packed with informative articles on this problematic phenomenon.
Companies are dealing more and more with advanced packages: Chip-scale packages, BGAs, stacked chips, through-silicon vias—the list goes on and on.
This issue dives into the hot issue of thermal management with insights from the importance of keeping LEDs cool to how to protect chip and solder joints after long thermal cycles.
It’s all about reliability this month, with features from Trace Labs, Nihon Superior, Cisco BFK Solutions, Steve Williams, and more!
What’s in the Tech Crystal Ball for 2011? by PC World’s Katherine Noyes focuses on IDC’s dramatic predictions for this year. Among them: Non-PC mobile devices will outnumber PC shipments within 18 months. Publisher Ray Rasmussen received so many thoughtful comments (in agreement and disagreement) with his November SMT column IPC Executive Summit: The End in Sight that he revisits the issue this month in The End in Sight, Part Deux. The suggestion that the PCB may be on its way to obsolescence seemed to strike a nerve with our subscribers.
Barry Matties bemoans the state of customer service in the US, with a few choice words and gives examples as illustrations, in his column We Are Tired of Being Screwed! You won’t want to miss this one! In See Ya ‘Round, Denny, Ray Rasmussen offers an assessment of outgoing IPC President Denny McGuirk’s 12-year term in office. In that time, IPC has become a real global organization. But argument about the role of IPC president continues: Should the president of IPC be a hands-on leader or not?
In our other columns:
While editors and technologists alike are busy touting the value of integration, Joe Fjelstad is taking things in the opposite direction. In Disintegrating the IC: An Alternative Approach to Increasing Semiconductor Integration, Joe points out the value of using "disintegrated" ICs, as well as the inherent challenge of coaxing the industry into rethinking its love affair with integration.
In his feature 2012: Slight Growth Following a Sluggish Start, Matt Scherer of Databeans Inc. sees a semiconductor market that’s growing, albeit ever so slowly. Is the middle of the year prime time for an upswing?
Is this the year manufacturing returns en masse to American shores? Is green energy truly ascendant? In Facing the Challenges of 2012 and Beyond, Anita LaFond of Constructive Communication makes sense of the myriad factors that promise to affect our industry in 2012.
Johannes Rehm of Rehm Thermal Systems is bullish about 2012, despite a touchy economy. In A Positive Perspective in Uncertain Times, he details a few oft-ignored facts, such as the growth exhibited by about 700 EMS providers over the past year.
Remember, electronics is still a great business to be in. Ray Rasmussen explains why in his column Outlook for 2012, and he points out the need to keep things in perspective. If you’ve been in the industry long enough, this business climate, with its ups and downs, should feel familiar.
Is there light at the end of the tunnel? Dr. Jennie S. Hwang of H-Technologies Group explores the economic outlook for 2012, along with trends in technology, in her column What Can We Expect in 2012?
Do you have the right people in your organization, and in the right positions? Barry Matties, in his column The Team Makes all the Difference, discusses the need to have the best people "on the bus," and sitting in the right seats.
Automation is on the rise.
With Foxconn Electronics' announcement that the company plans to add one million production robots to its manufacturing lines within the next three years, this is a good time to take a look at what's possible in automation. Is the uptick in robotic automation a hint of future unemployment?
The February issue of SMT Magazine addresses this issue with articles from Herbert Hofmann, ASM Assembly Systems; Adrian Scharli, Azular GmbH; and many more.
This month’s issue also features special coverage of IPC APEX EXPO 2012, this year’s will offer many valuable programs, exhibitions and demos on a wide range of industry topics. Our special coverage section is just small sample of what you’ll find in San Diego this year.
We hope to see you at the show!
Now on to our theme: Test and Inspection... Be it dealing with challenges brought on by high-speed components or addressing the loss of test access with new test methods, the March issue of SMT Magazine aims to provide readers new ideas and solutions. We’ll access our knowledge base of industry veterans to reveal the latest industry standards and practices.
Learn when, where, why, how and how much testing is required for electronic products. Find out more about compliance testing, developments in JTAG/boundary scan, how to fight tin whiskers, testing issues in mil/aero applications, and why reliability matters with articles from ScanCAD’s William Loving, GOEPEL’s Jens Kokott, Agilent’s Jun Balangue, NexLogic Technolgies’ Zulki Khan, Nordson YESTECH’s Andy Bonner, and many more.
Zulki Khan reveals the keys to selecting the correct boards for mil/aero applications; Steve Martell addresses the inspection of molded underfill flip chips; Susan Mucha gives you the secrets to satisfying defense customers; counterfeit electronics and their connection to China is examined by Dr. Michael Pecht and Len Zuga; Steve DeWaters gives insights from behind the "buy side" of the desk; the future of American PCB shops is spotlighted by Harvey Miller; and Chris Torrioni has an interview with the whistle-blower who took down MVP Micro. All this and much more can be found in this month’s issue.
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In this issue of SMT Magazine, Teradyne’s Michael Smith helps to ensure you’ll be able to test next-generation portable devices; Dr. Markus Riester discusses medical electronics manufacturing trends; Assembléon's Sjef van Gastel addresses repeatability in medical electronics production; Matthew Scherer and Brice Esplin, of Databeans provide a 2012 outlook on medical devices; and many more authors contribute to an in-depth discussion of the medical device manufacturing market.
Electronics manufacturers learned long ago that it’s much safer to be proactive with thermal issues throughout the product development process rather than face such issues when it's too late. So why do thermal issues still get the "Rodney Dangerfield" treatment?
In this issue of SMT Magazine, Anita LaFond presents Thermal Management for LEDs; Ward Gatza and Tom Evans of Agilent Technologies offer a reliability study on vapor-phase BGA in Thermal Cycle Reliability Study: Vapor Phase BGA Solder Joints, a paper that was presented at the 2012 IPC Technical Conference; Saturn Electronics’ Yash Sutariya has a Crazy Idea: Making PCBs out of FR-4; Robin Bornoff of Mentor Graphics gives a lesson in improving product design through thermal simulation in From Beer Fridges to Laptops, Thermal Simulation Improves Product Design; and SinkPAD Corporation’s Kris Vasoya explains why thermal management is criticalto the long life of LEDs used in solid state lighting in PCB: An Important Piece of the Puzzle IN LED Thermal Management.
Companies are dealing more and more with advanced packages: Chip-scale packages, BGAs, stacked chips, through-silicon vias—the list goes on and on. This month, we tackle the subject with an array of articles on advanced packaging.
In this issue of SMT Magazine, experts from Agilent address the evolution and voiding of solder joints on QFN central pads; authors representing ZESTRON question whether or not cleaning is critical for package-on-package assemblies; Raymond Clark and Joseph Poole of TT electronics take a look at the assembly and rework of lead-free PoP technology; SMT Trends and Technologies, the column from Sjef van Gastel of Assembleon chimes in with It's Getting Crowded; popular columnist Chris Torrioni investigates Microsemi’s silence concerning chip security; and Dr. Jennie S. Hwang concludes her list of important points to consider when dealing with lead-free assembly.
All this and much more can be found in this month's issue.
In this issue of SMT Magazine, David Lee and Lesly Pinol of Johns Hopkins APL, take a look at the effects of tin and copper nanotexturization on whisker formation; Thomas Lesniewski, Northrop Grumman, and Dave Hillman, Rockwell Collins, investigate whisker growth on tin-coated wire and braid; a team of researchers from CALCE address the likelihood of metal vapor arc by tin whiskers; a whisker mitigation process for surface mount components is revealed by Scott R. Sentz with AEM Inc.; and Dr. Jennie Hwang investigates whether or not microstructures indicate a good solder joint.
All this and much more can be found in this month’s issue of SMT Magazine.
The removal of post reflow flux residues is an integral part of the electronic assembly industry. When CFC-based solvents were pushed out, much of the commercial electronic assembly industry adopted a no-clean process, eliminating residue removal. Today, largely due to assembly miniaturization, increased component density and higher-temperature, lead-free alloys, cleaning has once again rejoined the assembly process.
In this issue of SMT Magazine, Saturn Electronics’ Yash Sutariya examines PCB reliability; Umut Tosun, Naveen Ravindran, and Michael McCutchen of ZESTRON present a paper on maintaining OSP coating integrity during cleaning; Craig McClenachan and Jim Stockhausen help readers select the right potting compound; Ascentech’s Gregory Alexander reviews ionic cleanliness testing; and regular columnists Dr. Jennie Hwang and Sjef van Gastel are joined by a new contributor, Karla Osorno of EE Technologies, Inc.
The focus this month is RoHS, REACH, and WEEE compliance and current legislation, waste water management, and many other environmental concerns encountered during manufacturing. OEM and EMS providers must be proactive and keep up with the latest changes in various countries to remain at the top of their game.
This issue brings readers a host of industry experts to address energy conservation, workplace safety, and sustainability issues; define green and green-washing legislation; present a conflict metals update; and offer the latest concerning REACH, RoHS, and WEEE and much more. Contributors include: Holly Evans of Strategic Counsel, LLC who asks if you're ready to deal with the RoHS Recast; I-Connect007's Richard Ayes who interviews SMTC's Brian Morrison about the challenges of being "green;" and David Dornfeld of University of California, Berkeley who addresses green manufacturing and resiliency.
Of special interest, the October issue marks the debut of our newest columnist, Anthony Hilvers, former vice president of industry programs at IPC. His column, titled, "Oh, Really?" should be a fun and interesting read.
All this and much more can be found in this month's issue.
The focus of the November issue of SMT Magazine is the players, the markets, and the future of the EMS industry. How will the industry look five, 10, even 15 years from now?
We asked industry experts to weigh in. Contributors include: Lavanya Rammohan of Frost & Sullivan with an outlook for the EMS market; Arthur R. Tan, president and CEO Integrated Micro-Electronics, Inc. (IMI), who provides a personal look at how his company weathered the economic downturn and remains optimistic for the future; Global Industry Analysts, Inc. offers analysis of industry trends and areas of future growth; and many more.
As always, read the latest columns from Editor Ray Rasmussen, Dr. Jennie S. Hwang; Tony Hilvers; Karla Osorno; Zulki Khan, and more. All this, industry news highlights, and upcoming events can be found in this month’s issue of SMT Magazine.
The December issue of SMT Magazine examines the best and worst of 2012 with a focus on plans for improvement in 2013.
Mike McNamara, of Flextronics, provides tips on surviving hardship and remaining competitive in today's market; Frost & Sullivan’s Lavanya Rammohan gives a snapshot of the EMS market in 2012; and Andrew Fletcher, of Reed Electronics Research, offers an outlook of the industry in Europe on the back of a weakening economy.
As always, read the latest columns from Editor Ray Rasmussen, Dr. Jennie S. Hwang; Tony Hilvers; Karla Osorno; Chris Torrioni, and more.
The January issue of SMT Magazine has every aspect covered, with articles from Components Direct’s Steve Martin addressing the impact of e-commerce on the component supply chain; George Henning of OCM Manufacturing advising how to choose between turnkey and consignment manufacturing; ESCATEC’s Daniel Pfeifer explaining how to give your global company a local advantage; and much more.
As always, read the latest columns from Editor Ray Rasmussen, Dr. Jennie S. Hwang; Karla Osorno; and more.
All this, industry news highlights, and upcoming events can be found in this month’s issue of SMT Magazine.
This issue also features our exclusive IPC APEX EXPO 2013 Pre-show Coverage, which includes information on technical conference sessions, standards development meetings, certification programs, IPC Buzz Sessions, a Real Time with... video overview, and much more.
The March issue of SMT Magazine looks at the industry’s many environmental issues, including the impact of legislation with a focus on RoHS and REACH compliance and enforcement, ITAR compliance, conflict minerals, and corporate social responsibility.
Also included in this issue is our exclusive IPC APEX EXPO 2013 post-show coverage. Our veteran team of guest editors and staff bring you the latest from the show floor, including new technologies and products, a review of key panel discussions, and, of course, our in-depth Real Time with… video interviews.
SMT Assembly Processes Part I: Stencil PrintingThe April issue of SMT Magazine addresses SMT Assembly Processes, including stencil paste printing/dispensing, component handling, ESD control, component placement, and odd-form placement.
The issue features 3M's James T. Adams, explaining how to find the perfect cover tape; Dr. Bill Coleman, vice president of technology at Photo Stencil, addressing the stencil printing of small apertures; Ricky Bennett and Eric Hanson covering low surface energy coatings; and many more articles and columns from industry experts, including, Zulki Khan, Eric Klaver, Karla Osorno, and Michael Ford.
SMT Assembly Processes Part II: Soldering Technology
The May issue of SMT Magazine focuses on soldering issues and features authors from Rehm Thermal Systems and Balver Zinn who examine the surface tension and load-carrying capacities of solder. Seth J. Homer and Dr. Ron Lasky of Indium Corporation discuss ways to reduce voiding in QFN packages.
Additional articles and columns from industry experts, including, Dr. Jennie Hwang, Zulki Khan, Sjef van Gastel, Karla Osorno, and new columnist Rachel Short can be found in the issue as well.
The theme for the June issue of SMT Magazine is high-reliability with a focus on standards and specifications; counterfeit components; certification; security, testing, and quality assurance issues.
Read in-depth articles from the best in the industry including Ed Habtour, U.S. Army Materiel Systems Analysis Activity, and Cholmin Choi, Michael Osterman, and Abhijit Dasgupta, CALCE. The feature article presents a novel approach to improve reliability in U.S. Army vehicles. Lavanya Rammohan, Frost & Sullivan, explains the EMS provider’s role in combating counterfeit components.
As always, the June issue also includes several columns from our industry experts, including Derek Snider, Michael Ford, Rachel Miller-Short and Karla Osorno.
Thermal management is in the hot seat this month, with feature contributors from Koki Company Ltd., Christopher & Associates, Air-Vac Engineering, and Verdant Electronics, taking on a range of thermal management issues, including applications of lead-free alloy solder pastes, through-hole rework of thermally challenging components and assemblies, and so much more!
From our columns department, Jennie Hwang, Karla Osorno, Eric Klaver and Ray Rasmussen are on hand to enlighten and inform. Don’t miss our highlights, with current headlines from throughout the industry and feature video from our Real Time with series.
High Density PackagingIt’s no secret that packages are becoming denser all the time. But how does this affect the PCB assembly process? In this issue of SMT Magazine, our expert contributors explain the ins and outs of high-density packaging, as well as tips and techniques for dealing with packages chock full of ever-increasing levels of technology.
Hear from our contributors and columnists as they discuss best practices for assembling today’s high-density packages. Atotech’s Olaf Kurtz, Jürgen Barthelmes, Eckart Klusmann, Robert Rüther, and Stephen Kenny discuss strategies for using layers of cost-effective palladium. And a team from Altera Corporation and Amkor Technology present a case study that evaluates the use of molded flip-chip BGA packages in 28nm FPGAs.
As always, catch up on the latest columns from Sjef van Gastel, Rachel Short, Michael Ford, Karla Osorno, Zulki Khan, and much more.
Test & Inspection
Pass the test with SMT! In this issue, we explore the latest and greatest test and inspection processes related to PCB assembly. Our contributors from Agilent, Teradyne, ASSET Intertech and Cincinnati Sub Zero focus on ICT, HALT, HASS, and much more.
We’ve seen a myriad of developments in lead-free solder and surface finishes since RoHS went into effect seven years ago. But the state of lead-free changes almost every day. In the October issue of SMT Magazine, our contributors and columnists explore the often confusing world of lead-free processes. Nihon Superior’s Tetsuro Nishimura discusses the bleeding edge of lead-free soldering. And a case study by Continental Corporation’s José Mar’a, Serv’n Olivares and Cynthia Gómez Aceves details how TOF SIMS analysis helped provide insight into wetting issues with lead-free HASL processes.
As always, this month we feature columns by our team of experts, including Ray Rasmussen, Michael Ford, Sjef van Gastel, Rachel Short, and Zulki Khan. All this, industry news highlights, and upcoming events can be found in this month’s issue of SMT Magazine.
Rework, Modification & Repair
The repair and rework of packages is becoming more complex and expensive, especially with today’s advanced packages. In the November issue of SMT Magazine, our contributors and columnists get to the bottom of rework, modification and repair. Air-Vac Engineering’s Brian Czaplicki discusses the advanced rework of bleeding-edge packaging systems. And an article by Jet Propulsion Laboratory’s Reza Ghaffarian, Ph.D., details the rework and reliability of high-I/O CGA assemblies.
As always, this month we feature columns by our team of experts, including Ray Rasmussen, Dr. Jennie Hwang, Karla Osorno, and Eric Klaver.
All this, industry news highlights, and upcoming events can be found in this month’s issue.
Our Columnists Speak
As 2013 comes to a close, our columnists look back on the past year and make predictions for the upcoming year. In the December issue of SMT Magazine, Publisher Ray Rasmussen wraps up 2013 and discusses what we might expect to see in 2014. Dr. Jennie S. Hwang looks back on her predictions from last year and details where she got it right, and wrong. Rachel Short explains why your relationship with your stencil maker will be so important in 2014. And Michael Ford discusses why he believes electronics manufacturing is experiencing its "teen" years: Full of expectation, but lacking capital.
As always, this month we feature columns by our team of experts, including Sjef van Gastel, Zulki Khan, and Karla Osorno.
This month, Trace Labs’ Renee Michalkiewicz covers the corrosion and reliability characteristics of fluxes; Nihon Superior supplies a comprehensive analysis of lead-free solder joint reliability and Cisco offers a complete look at predicting pad crater failures. Steve Williams and BFK Solutions round out our line-up of features!
Don’t miss new Real Time with… video content from HKPCA and productronica 2013!
SMT Assembly, Part 1
This month, our cover story from Shea Engineering Services probes the stencil manufacturing process, including stencil printing experiments. Also featured this month: Testing Intermetallic Fragility on ENIG upon Addition of Limitless Cu (Universal Instruments Corp.); Making Sense of Accuracy, Repeatability and Specification for Automated Fluid Dispensing (Nordson ASYMTEK); Big Ideas on Miniaturisation (DEK).
Don’t miss new Real Time with… video content from productronica 2013, SMTA and more!
SMT Assembly, Part 2: Making the Connections
In Part 2 of our assembly process series, SMT Magazine helps make the connections! This month, we dig deeper into the no-clean vs. water-soluble solder paste argument, the overstress of components during the soldering process, the feasibility of low/no-silver solder pastes, the influence of microstructure on bismuth lead-free solders, and high-temperature assembly materials.
Plus: IPC APEX EXPO preview!
Plus, show coverage from IPC APEX EXPO, including interviews, overviews, pictures and more!
Test & Inspection of Electronic Assemblies
This month, Alejandro Castellanos, et al of Flextronics explains how this company uses X-ray inspection to fight head-in-pillow defects. Ronald Frosch of AT&S discusses a novel method for forecasting drop shock performance. Rob Humphrey of XJTAG looks at a variety of ways to achieve signal integrity in test fixtures. Alan Albee of Teradyne focuses on the changing economics of in-circuit test. And NK Chari of Agilent explains solid management practices for PCBA test.
You’ll also find an article by Dan Hoz of Mentor Graphics, as well as columns by Dr. Jennie Hwang, Ray Rasmussen, Todd Kramer, and Sjef van Gastel.
All this, plus industry news highlights and upcoming events, can be found in this month’s issue of SMT Magazine.
It must be summer, because this month, SMT Magazine is turning up the heat on thermal management! Features include Gregor Langer, Markus Leitgeb, et al., who look into advanced thermal management solutions for high-power applications.
Carlos Montemayor investigates the high-temperature reliability limits for silicone adhesives, and Mark Challingsworth examines trends in thermal management for electronic circuits.
This month, our cover feature by Dr. Jennie Hwang encapsulates the phenomenon of tin whisker. Inside features include articles from Andrzej Czerwinski (Institute of Electron Technology) and Linda Woody and William Fox (Lockheed Martin). Also included is an article by Edward Briggs (Indium), who takes on the future of stencil printing challenges.